제품 기술

Small Outline Package

Applications：

 Power Management (DC-DC, AC-DC) 

 LED   Driver

 Flash Memory (Nor Flash, EEPROM)

 Industry Controller

Features:

 JEDEC Standard package outlines

 Au, Cu, Ag-alloy, Al bonding process   capabilities

 Multi-chip capability for stack or flat lie

 Exposed die pad packaging  (eSOP)

 Lack Pin6 or Pin7 is optional for SOP 7L

 Component surface mount capability

Reliability Condition:

 Moisture Sensitivity Pre-condition :
   -MSL3: 192hrs@30℃/60% RH
   -MSL1: 168hrs@85℃/85% RH

 Temperature Cycle: 500 cycles @ -65℃ /+150℃

 uHAST:96hrs @130℃/85% RH

 High Temperature Storage: 1000hrs@150℃

Package Outlines   Dimensions: